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专业成绩：GPA 3.8/4.0（专业前10%）

主修课程：模拟电子技术、数字电子技术、信号与系统、单片机原理及应用、数字信号处理、嵌入式系统设计、自动控制原理、PCB设计与制造、Verilog/VHDL硬件描述语言、电路分析等。

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设计基于Arduino Mega2560的智能避障系统，使用超声波传感器和红外传感器实现环境感知
负责机械结构设计与传感器接口电路开发，优化PCB布局减少电磁干扰
编写PID控制算法实现电机速度闭环控制，系统避障成功率达98%以上
项目获省级电子设计竞赛二等奖

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设计基于STM32F103的智能温控系统，实现DS18B20温度采集与LCD1602显示
完成原理图设计与PCB layout，通过Altium Designer实现2层板布线
编写C语言驱动程序，实现温度闭环控制与异常报警功能
系统温度控制精度达±0.5℃，稳定性测试通过1000小时验证

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协助完成消费类电子产品硬件测试，包括功能测试、性能测试和可靠性测试
参与编写测试方案与SOP文档，优化测试流程使效率提升20%
协助工程师进行PCB板初步检查，学习EMC测试与信号完整性分析
参与元器件选型工作，整理200+种电子元件参数库

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硬件设计：精通模拟/数字电路设计，熟练使用Altium Designer/Cadence完成原理图与PCB设计
嵌入式开发：掌握C语言编程，熟悉STM32/Arduino平台，能独立开发驱动程序
测试验证：熟悉示波器、逻辑分析仪等测试工具使用，掌握EMC/信号完整性分析方法
工具软件：熟练使用Multisim仿真，掌握MATLAB/Simulink进行信号系统分析

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电子设计竞赛：省级二等奖，系统完成智能避障全流程开发
学业成绩：专业GPA 3.8/4.0，连续两年获校级一等奖学金
英语能力：CET-6（580分），能流畅阅读英文技术文档

"}, "name": "award", "sort": 8, "value": "荣誉证书", "visible": "1"}, {"data": {"editor": "

硬件工程专业背景扎实，具备从原理图设计到系统调试的完整工程能力
在校期间主导/参与多个项目，培养了独立解决复杂问题的能力
学习能力强，快速掌握新技术工具，能适应硬件行业快速迭代需求
具备良好团队协作精神，在项目中擅长跨专业沟通与资源协调
对硬件工程师岗位有强烈热情，期待在实践中持续提升专业技能

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